力晶半导体周四（5 月 3 日）举行了新的 12 英寸晶圆厂落成仪式，称一号线已进入试产阶段，预计 2024 年下半年开始生产用于 CoWoS 封装的硅中介层。力晶已投资到目前为止，该晶圆厂的投资额为新台币 800 亿美元，但到全面投产时，投资总额将达到 3,000 亿新台币（92 亿美元），每月生产 5 万片晶圆。$台積電.US
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