SK 海力士预计,由于 HBM3E(高带宽内存)芯片的销售速度越来越快,该芯片将于第三季度投入量产,到 2024 年底,累计 HBM 内存芯片收入将达到 “100 亿美元左右”。据《Elec》报道。 HBM3E 是此类 DRAM 存储芯片的第五代。$美光科技.US $英偉達.US

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