📢 𝗝𝗨𝗦𝗧 𝗜𝗡: $GlobalFoundries(GFS.US) GlobalF

📢 𝗝𝗨𝗦𝗧 𝗜𝗡: $GlobalFoundries(GFS.US) GlobalFoundries Signs LOI for $𝟯𝟬𝟬 𝗠𝗶𝗹𝗹𝗶𝗼𝗻 CHIPS R&D Award to Advance AI Photonics - $AMD(AMD.US) $NVIDIA(NVDA.US) $Microsoft(MSFT.US) $Meta Platforms(META.US) $Broadcom(AVGO.US)

👉 𝗞𝗲𝘆 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀:

➤ 𝗚𝗹𝗼𝗯𝗮𝗹𝗙𝗼𝘂𝗻𝗱𝗿𝗶𝗲𝘀 signs LOI for a $𝟯𝟬𝟬 𝗺𝗶𝗹𝗹𝗶𝗼𝗻 CHIPS R&D award.

➤ Funding will accelerate next-generation 𝘀𝗶𝗹𝗶𝗰𝗼𝗻 𝗽𝗵𝗼𝘁𝗼𝗻𝗶𝗰𝘀 development for AI infrastructure.

➤ R&D focuses on 𝗼𝗽𝘁𝗶𝗰𝗮𝗹 𝗺𝗮𝘁𝗲𝗿𝗶𝗮𝗹𝘀, wafer technologies, and advanced packaging.

➤ Program supports 𝗻𝗲𝗮𝗿-𝗽𝗮𝗰𝗸𝗮𝗴𝗲𝗱 and 𝗰𝗼-𝗽𝗮𝗰𝗸𝗮𝗴𝗲𝗱 optics deployment.

➤ Commerce Department will receive approximately 𝟭% equity ownership in GlobalFoundries.

➤ Initiative builds on GF's 𝗦𝗖𝗔𝗟𝗘™ silicon photonics platform.

➤ Platform targets 𝟰𝟬𝟬𝗚𝗯/𝘀 performance and 𝟱𝘅 greater energy efficiency.

➤ R&D and manufacturing will leverage GF facilities in 𝗡𝗲𝘄 𝗬𝗼𝗿𝗸 and 𝗩𝗲𝗿𝗺𝗼𝗻𝘁.

➤ Industry leaders including 𝗔𝗠𝗗, 𝗡𝗩𝗜𝗗𝗜𝗔, 𝗠𝗶𝗰𝗿𝗼𝘀𝗼𝗳𝘁, 𝗠𝗲𝘁𝗮, and 𝗕𝗿𝗼𝗮𝗱𝗰𝗼𝗺 backed the initiative.

👉 𝗪𝗵𝘆 𝗧𝗵𝗶𝘀 𝗠𝗮𝘁𝘁𝗲𝗿𝘀:

➤ Strengthens U.S. leadership in AI chips, optical networking, and semiconductor manufacturing.

➤ Silicon photonics is becoming essential to scaling next-generation AI data centers.

➤ Faster optical interconnects reduce power consumption and eliminate data movement bottlenecks.

➤ Reinforces domestic AI supply chains through government and industry collaboration.

👉 𝗘𝘅𝗽𝗲𝗿𝘁 𝗦𝘁𝗮𝘁𝗲𝗺𝗲𝗻𝘁𝘀:

𝗛𝗼𝘄𝗮𝗿𝗱 𝗟𝘂𝘁𝗻𝗶𝗰𝗸, U.S. Secretary of Commerce:

“With today’s compute supply chain investments, the Trump Administration is accelerating America’s innovation engine. These strategic investments will enhance our country’s domestic capabilities, create high-paying jobs and keep America at the forefront of the semiconductor industry.”

𝗕𝗶𝗹𝗹 𝗙𝗿𝗮𝘂𝗲𝗻𝗵𝗼𝗳𝗲𝗿, Executive Director for Semiconductor Innovation and Investment, U.S. Department of Commerce:

“The CHIPS R&D incentives will support a breakthrough in compute and communication networks moving past traditional copper bottlenecking to power next-generation AI. Accelerating R&D for domestic photonics capabilities and advanced packaging provides American industry the extreme bandwidth and energy efficiency to scale complex AI workloads securely and rapidly.”

𝗧𝗶𝗺 𝗕𝗿𝗲𝗲𝗻, CEO of GlobalFoundries:

“Silicon photonics is essential to AI infrastructure. For a decade, the industry talked about the shift from copper to optical as something that was coming — today it is here, moving data at higher bandwidth and improved power efficiency as workloads grow more complex. GlobalFoundries has spent more than a decade building the technology, footprint and ecosystem to lead this transition, and we have the proven manufacturing foundation to scale it — in the United States — accelerating technology leadership for generations to come. We are proud to deepen our partnership with the U.S. Government, and the CHIPS R&D Office in particular, to accelerate our programs.”

𝗚𝗿𝗲𝗴𝗴 𝗕𝗮𝗿𝘁𝗹𝗲𝘁𝘁, Chief Technology Officer of GlobalFoundries:

“As we accelerate development of next-generation optical materials and co-packaged optics, GF is building on our already qualified portfolio of photonic devices, proven 3D hybrid bonding and advanced packaging expertise, combined with our manufacturing scale to bring near-packaged and co-packaged optics to high volume — putting our customers on a direct, U.S.-based path to scaling optical connectivity for tomorrow’s AI systems.”

𝗝𝗲𝗻𝘀𝗲𝗻 𝗛𝘂𝗮𝗻𝗴, Founder and CEO of NVIDIA:

“Rebuilding our supply chains is critical to the new industrial revolution. Scaling US manufacturing requires advances across chips, networking, optics, software, and manufacturing. Silicon photonics is essential to that future, and GlobalFoundries brings the manufacturing expertise to help make it real in the United States."