$Micron Tech(MU.US)$Sandisk(SNDK.US) The shortage next year could be even more severe, plus NAND is being heavily consumed in AI.

HBM consumes approximately three times the wafer capacity of general-purpose DRAM. As the industry transitions to HBM4 this year, this gap may widen to nearly four times, and it could be even larger with next year's HBM4E. Therefore, the incremental growth of HBM will disproportionately divert wafer capacity from general-purpose DRAM, exacerbating the structural tightness in memory supply.