Déjà vu all over again. JEDEC partners are reportedly considering increasing the maximum height for #HBM stacks, similar to the change made two years ago that enabled 16-high stacks. Last time, this decision had the effect of pushing back the adoption of the more complex and costly #HybridBonding approach for HBM. We would expect a similar dynamic if the standard is adjusted again.
Source: Chips & Wafers
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