Powertech, the memory chip packaging and testing firm, raised its 2026 capex plan to NT$44.3 billion (US$1.41 billion) from NT$40 billion previously to expand advanced semiconductor packaging capacity, media report, adding much of the spending will be on FOPLP (Fan-Out Panel-Level-Packaging) lines. Powertech is expected to hire 2,044 workers for the new production lines. #semiconductors
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
