SK Hynix will invest 19 trillion won (US$12.9 billion) in an advanced semiconductor packaging plant in South Korea to keep up with strong AI-related demand, Reuters reports. Construction will begin in April and finish by end-2027. The plant will be for High Bandwidth Memory (HBM) memory chips, the key AI memory. $HXSCL $SSNLF $Micron Tech(MU.US) #skhynix #samsung #semiconductors
Source: Dan Nystedt
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