Earthquake Update: TSMC hopes to be back up to 100% today after the 7.0-magnitude temblor late Saturday (12/27) caused emergency shut-downs of some machinery in Hsinchu-based fabs (north Taiwan) and some scrapped wafers in production, media report, noting TSMC engineers rushed in after the quake to recalibrate machinery. Taiwan memory chip makers Nanya Tech, Winbond further north felt a bigger impact with damage to wafers in progress, etc. with some equipment requiring recalibration. It may take several days to be back to full production. $Taiwan Semiconductor(TSM.US) #Nanya #Winbond #semiconductors
Source: Dan Nystedt
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