TSMC is aggressively expanding advanced chip packaging capacity to meet explosive AI related demand, media report, noting TSMC held an equipment move-in ceremony at AP7 on Thursday, its new P2 plant in Chiayi, south Taiwan. The plant faced a number of delays after ancient artifacts were found at the site and later, construction accidents. TSMC’s AP8 facility in nearby Tainan also recently began equipment move-in at its P2 plant. AP8 does CoWoS work, while AP7 does CoWoS as well as WMCM, SoIC and CoPoS. $Taiwan Semiconductor(TSM.US) #semiconductors #semiconductor
Source: Dan Nystedt
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