Rumor: TSMC Arizona may start building an advanced semiconductor packaging plant ahead of schedule on land currently set aside for fab P6, media report, with equipment installation possible by end-2027 if construction is smooth. TSMC had originally partnered with Amkor to provide advanced packaging when its Arizona facility is ready, but that’s not expected to be until 2028. $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) $NVIDIA(NVDA.US) $Apple(AAPL.US) $AMD(AMD.US) #Semiconductors #semiconductor
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
