
Very confident tone from #HanmiSemiconductors regarding their position at all three #HBM suppliers and #HBM4 market share:
🔸Sales from overseas customers are expected to 2x+ sales from a specific domestic customer last year. Expect overseas sales to surpass domestic sales over the next 3 to 4 years🔸Confident they will receive all orders for HBM4; will monopolize HBM4 orders.🔸Preparing next-generation equipment such as fluxless bonding (shipments in '25) and hybrid bonding (launch in '27) without any issues.🔸Preparing to increase capacity to 45 UPM next year.🔸Hanmi produces both MR-MUF and TC-NCF types of equipment and ~70% are mass-produced on the same production line.$Micron Tech(MU.US) #SKynix $BESI $SECSource: Chips & Wafers
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
