TSMC will break ground on its 1st USA advanced semiconductor packaging plant next year, aimed at SoIC and CoW (oS) production, with oS work to be done by partner Amkor, media report.
SoIC: System on Integrated ChipCoWoS: Chip-on-Wafer-on-Substrate. $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) #semiconductorsSource: Dan Nystedt
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