At #ECTC, $Intel(INTC.US) announced at upgraded version of EMIB called 'EMIB-T'
With this technology, customers can connect 12+ full sized silicon dies in a single package. The technology also helps with power and thermal controls.$Intel(INTC.US) Foundry looks to be taking a page out of the $Taiwan Semiconductor(TSM.US) handbook; Packaging to win business.Source: Chips & Wafers
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