Foxconn Interconnect (FIT) has started mass production of key components for Broadcom’s CPO (co-packaged optics) platform, Tomahawk 5 (TH5) Bailly, media report, adding CPO uses optics to speed up data transmission in AI data centers. FIT said it is also developing next-generation 200Gbps per-lane CPO components with Broadcom as well. $Broadcom(AVGO.US) $NVIDIA(NVDA.US) #semiconductors
Source: Dan Nystedt
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