As #AdvancedPackaging become more important and enabling, we are likely to see in increase in the number of tool suppliers.
"Hanwha Semiconductor has established the 'Advanced Packaging Equipment Development Center' ... plans to focus on the development of new technologies such as hybrid bonding."$BESI #ASMPT $Kulicke and Soffa(KLIC.US) #Hanmi #ShibauraSource: Chips & Wafers
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