TSMC’s 2nm process is progressing smoothly, with defect density (D0) matching 5nm and surpassing 3nm and 7nm at similar stages of development, and mass production seen in Q4 2025, media report. AMD’s “Venice” EPYC processor was the first to complete tape-out on 2nm, and Apple’s iPhone 18 is expected to use 2nm chips. Monthly 2nm capacity is projected at 50,000 wafers-per-month by year-end, potentially reaching 80,000 if progress stays on track. $Taiwan Semiconductor(TSM.US) #semiconductors #semiconductor
Source: Dan Nystedt
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