消息称 SK 海力士为应对 HBM 需求激增 拟增加封装技术人员

Zhitong
2023.08.25 06:13
SK 海力士正在内部招聘 “后处理” 人员，以扩大生产规模。半导体行业消息人士 24 日透露，SK 海力士的晶圆级封装部门最近决定重新分配和加强封装技术人员，该部门负责下一代封装技术的开发和大规模生产。人员的增加是为了应对人工智能投资激增所带来的对 HBM 快速增长的需求。
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