摩根大通：台积电 CoWoS 产能明年底前或翻至每月 2.8 万至 3 万片

Zhitong
2023.08.16 02:36
摩根大通最新调查显示，AI 需求下半年持续强劲，台积电 CoWoS 产能扩张进度将超越预期，明年底前产能翻至每月 2.8 万-3 万片，尤其 2024 年下半年扩产速度值得期待。摩根大通估计，英伟达 2023 年就占整体 CoWoS 需求量的 6 成，台积电约可生产 180 万-190 万套 H100 芯片，接着需求量较大的则是博通，再来还有亚马逊云科技的 Inferentia 芯片与赛灵思。放眼 2024 年，因台积电产能持续扩张，可供应英伟达所需的 H100 芯片数量上看 410 万～420 万套。
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