消息称高通与日月光、矽品计划共同开发新品对标苹果 M 系列芯片 包括先进制程、先进封装等技术

Zhitong
2023.06.19 23:53
相关供应链业者透露，高通 2023 年第一季时，召集日月光投控与旗下矽品等封测代工公司，并与 OSAT 端研发人员在高通圣地牙哥总部 “蹲点”，历时约 3 个月至 2023 年 6 月左右，计划开发新品，希望对标苹果 M 系列芯片。其中除半导体先进制程外，各类中高阶或是先进封测技术，也是高通必要策略考量之一。
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