消息稱三星力拼晶圓級先進封裝 台廠成熟度領先 2-3 年

華爾街見聞
2023.05.10 01:56
熟悉先進晶圓級封測行業人士透露，外傳三星電子有意在 2023 年第四季度生產晶圓級扇出封裝（FOWLP）的自家手機應用處理器（AP）並非不可能。不過，以量產成熟度、良率、成本競爭力而言，台系先進封測供應鏈至少領先 2-3 年以上，三星初期仍 “高度參考” 龍頭台廠封裝架構。 (台灣電子時報)
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