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英特尔推迟与台积电 3nm 芯片合作订单

JIN10
2023.02.21 03:08
美港电讯 APP 2 月 21 日讯，据电子时报报道，PC 制造商消息人士透露，英特尔 (INTC.O) 将推迟向台积电 (TSM.N) 下 3nm 芯片订单至 2024 年第四季度。PC 行业人士表示，近年来，英特尔的制造工艺和 PC 平台蓝图频繁修改，产品上市延迟严重打乱了供应链的产销计划。消息人士称，英特尔与台积电在 3nm 制造方面的合作将推迟到 2024 年第四季度，为 Arrow Lake 制造 GFX tile，并补充说 Panther Lake 和 Nova Lake 预计将在 2025 年第三季度和 2026 年分别推出。
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